Samsung starts HBM packaging plant in Asan with 46 trillion won investment
Briefing by News4U · First published
ITHome reported that Samsung Electronics held a groundbreaking ceremony today for a new HBM backend packaging facility at its Onyang campus in Asan, South Korea, attended by President Lee Jae-myung. The project includes five production lines, with total investment of 46 trillion won (6 trillion won for buildings and 40 trillion won for equipment). The three-story plant will add 31,000 square meters of cleanroom space and is scheduled to begin production in 2028, expanding the campus’s total floor area from 270,000 to 420,000 square meters. [1]
Sources
- 三星电子韩国温阳产区新 HBM 产线动工，总投资额 46 万亿韩元
ITHome · · Summary only