Musk's Terafab plans 2032 output to match Samsung DRAM scale
Briefing by News4U · First published
ITHome reports Elon Musk's Terafab plans to reach 1 million wafers per month by 2032, with 700,000 wafers for storage chips and 300,000 for logic chips, matching Samsung's current DRAM monthly capacity of 650,000-700,000 wafers. [1]
Sources
- 马斯克半导体工厂 Terafab 规划曝光,存储芯片产能直接对标三星
ITHome · · Summary only