Musk's Terafab plans 2032 output to match Samsung DRAM scale

Briefing by News4U · First published

ITHome reports Elon Musk's Terafab plans to reach 1 million wafers per month by 2032, with 700,000 wafers for storage chips and 300,000 for logic chips, matching Samsung's current DRAM monthly capacity of 650,000-700,000 wafers. [1]

Sources

  1. 马斯克半导体工厂 Terafab 规划曝光,存储芯片产能直接对标三星

    ITHome · · Summary only

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